• LinkedIn
  • KONTAKT
  • ANNONCERING
  • PARTNERLOGIN

ElektronikFOKUS

Fokus på elektronik

  • Branchenyt
  • Design & udvikling
  • Events
  • IoT & embedded
  • Komponenter & konnektorer
  • Power
  • Produktion
  • Test & mål
  • Wireless & data
  • Artikler fra Aktuel Elektronik

International news16. 09. 2019 | Rolf Sylvester-Hvid

High-Speed Battery Charging in Next-Generation Electric Vehicles

International news16. 09. 2019 By Rolf Sylvester-Hvid

STMicroelectronics has been chosen to supply high-efficiency silicon-carbide (SiC) power electronics by Renault-Nissan-Mitsubishi (Alliance) for advanced on-board chargers (OBCs) in its upcoming electric vehicles.

Renault-Nissan-Mitsubishi plans to use the new SiC power technology to build more efficient and compact high-power OBCs that will further increase attractiveness of electric vehicles for the users by cutting battery-charging time and enhancing driving range. As Renault-Nissan-Mitsubishi’s chosen partner for advanced SiC technology, ST will provide design-in support to help maximize OBC performance and reliability.

ST is also to supply Renault-Nissan-Mitsubishi with associated components, including standard silicon devices. The OBCs with ST’s SiC are scheduled to enter volume production in 2021.

“As the pioneer and global leader in zero-emission electric vehicles, our objective remains to be the number one provider of mainstream mass-market and affordable EVs around the world,” said Philippe Schulz, Alliance VP Design Electric & Hybrid Powertrain. “The small size, light weight, and high energy efficiency we can achieve using ST’s SiC technology in our OBC, combined with the increased battery efficiency, will enable us to accelerate the adoption of electric vehicles by reducing charging times and extend the range of our EVs.”

Marco Cassis, President, Sales, Marketing, Communications and Strategy Development, STMicroelectronics, said, “SiC technology can help the world by reducing dependence on fossil fuels and increasing energy efficiency. ST has successfully developed manufacturing processes and established a portfolio of qualified, commercialized SiC products also in automotive-grade version. Building on our long cooperation, we are now working with Renault-Nissan-Mitsubishi to realize the many advantages SiC can bring to EVs. Moreover, this commitment helps ensure success by increasing the economies of scale to deliver superior-performing SiC-based circuits and systems that are also cost-effective and affordable.”

EVs need an OBC to handle charging from standard roadside charge points, when a dedicated home-charging system or super-charger is not available. The time to recharge is determined by the OBC power rating and the units in today’s EVs have ratings between about 3kW and 9kW.

As the leading EV brand, Renault-Nissan-Mitsubishi has already created a 22kW OBC for the Renault Zoe model, which can fully recharge the battery in about one hour. Now, by upgrading the OBC to leverage the superior efficiency and small size of ST’s SiC power semiconductors (MOSFETs and rectifier diodes), Renault-Nissan-Mitsubishi can further reduce the size, weight, and cost while increasing energy efficiency to make future models even more attractive for users and beneficial for the environment. The new, compact, and high-power OBC gives designers more freedom to style the vehicle and optimize packaging, weight distribution, and vehicle drivability.

SiC is a proven power-semiconductor technology that enables highly efficient power switches (MOSFETs) and rectifiers (diodes) and is backed by trusted reliability data. In engineering terms, SiC is a wide bandgap (WBG) semiconductor material that works at higher frequencies, can withstand higher operating temperatures, and with smaller form factors than traditional Silicon-based materials. These advantages give component designers superior control over device characteristics, better optimizing the balance among physical dimensions, MOSFET on-resistance (RDS(ON)), diode forward voltage (VF), and factors such as capacitance and gate charge that affect turn-on/off or reverse-recovery times and the energy dissipated when switching. Compared to conventional silicon, WBG semiconductors can withstand higher applied voltages in relation to device size, which allows lightweight components to be extremely rugged as well as highly energy-efficient.

In addition to automotive uses like OBCs, ST’s SiC MOSFETs and rectifiers are also widely used for power conditioning and conversion in the renewable-energy sector, and in other equipment such as industrial automation, high-voltage DC distribution, data-center power supplies, and smart lighting, where maximizing energy efficiency is the overriding demand.

Further information can be found at http://www.st.com

Skrevet i: International news

Seneste nyt fra redaktionen

Højpålidelige NTC-termistorer tåler op til +175°C

Komponenter & konnektorer18. 02. 2026

TDK Corporation udvider deres NTCSP-serie af NTC-termistorer. Disse komponenter er designet til montering med ledende lim til drift i miljøer med høje temperaturer op til +175 °C. Masseproduktionen af ​​denne serie begyndte i februar 2026. For at opnå højere ydeevne i bilindustrien kræves der

High-side driver fra STMicroelectronics forsyner og beskytter logik mod kraftige transienter

Komponenter & konnektorerPower18. 02. 2026

Med en minimum driftsspænding på 4V forsyner STMicroelectronics' VNQ9050LAJ 4-kanals high-side driver især biler og beskytter mod forstyrrelser, herunder ekstrem koldstart, helt ned til 2,7V, hvilket øger køretøjets pålidelighed og sikrer en overlegen brugeroplevelse. Denne robusthed, når den

NKT indgår toneangivende kobberaftale på seks mia. euro med KGHM

Branchenyt18. 02. 2026

NKT’s kobberbehov fortsætter med at stige i takt med virksomhedens udvidelse af produktionskapaciteten for at imødekomme den høje globale efterspørgsel efter elkabler. Adgang til pålidelige kobberkilder er derfor afgørende for at bevare NKT’s konkurrenceevne og styrke robustheden i virksomhedens

Kompakte 1U 3500 W industrielle rack-strømforsyninger med redundant hot-swapping

Power18. 02. 2026

TDK Corporation annoncerer TDK-Lambdas HFE3500 rackmonterede industrielle 3.500 W strømforsyningsserie. Hvert 1U højt 19” rack kan rumme op til fire strømforsyninger, der leverer 13.300 W bulkstrøm, eller fungere som et hot-swap redundant system. De interne ORing MOSFET'er og strømdelingsfunktionen

Nordisk Innovations Forum med skarp fokus på faglighed inden for elektronikproduktion

AktueltEventsProduktion18. 02. 2026

To heldags-event i henholdsvis Odense, 24. marts, og Oslo, 26. marts, er HIN A/S bud på en fremragende mulighed for at stifte bekendtskab med branchens nyeste teknologier indenfor SMT /THT, lodde- og renseprocesser. Formålet med disse heldagsmøder og -seminarer er at skabe innovation samt tids-

SDU-forskeres algoritme kan blive et vigtigt skridt mod privatliv i en AI-tid

AktueltIoT & embeddedWireless & data18. 02. 2026

Hvis man som bruger vil sikre sit privatliv, er det ikke nok at bede techvirksomhederne slette ens data. Det, AI-modellerne har lært fra dataen, skal også aflæres. Det har forskere fra SDU Applied AI and Data Science nu fundet en måde at gøre, uden at modellerne bliver dårligere. Med

Ny rapport om innovativ energiteknologi: Sådan skal 628 millioner kroner bruges

Design & udviklingPowerTop18. 02. 2026

EUDP har igen i 2025 været med til at sætte skub i en række nye grønne energiteknologier. Programmet har i løbet af året uddelt i alt 628 millioner kroner til 81 innovative projekter. Nu kan man dykke dybere ned i hvordan støtten skal bruges. EUDP er teknologineutral i sin tilgang og favner

Kontron inviterer til møde på Embedded World

EventsIoT & embedded16. 02. 2026

Kontron, der er blandt de førende globale leverandør af IoT/embedded computer technology (ECT), vil præsentere sin omfattende portefølje af ydedygtige, sikre og skalérbare embeddede- og edge AI-løsninger på Embedded World 2026. Under mottoet "Secure. Connected. CRA ready" demonstrerer Kontron,

Toshiba lancerer high-speed lineær farve-CCD billedsensor til AOI-udstyr

Komponenter & konnektorer16. 02. 2026

Toshiba Electronics Europe GmbH lancerer TCD2400DG, en ny type af lineær linsereduktions CCD-billedsensor designet til at opfylde selv de mest krævende specifikationer i moderne optisk inspektionsudstyr. Den nye sensor er udstyret med 4.096 elementer med en 7 µm pitch og er tiltænkt brug i

4kW e-mobilitets DC/DC-konverter med 180-950VDC-indgang

Power16. 02. 2026

Recoms RMOD4000-serie af kompakte plug-and-play DC/DC-konvertere er en priseffektiv løsning til levering af isolerede 14V-, 28V- eller 56VDC-spændings-rails ved en høj indgangsspændinger mellem 180- og 950VDC fra batterier i alle slags e-fartøjer. Op til 4kW er tilgængelig afhængigt af variant og

Tilmeld Nyhedsbrev

Tilmeld dig til dit online branchemagasin/avis

 
 
 
 
Aktuel Elektronik - underleverandøroversigt
Få fuld adgang til indlægning af egne pressemeddelelser… Læs mere her

/Nyheder

  • SynFlex A/S

    Højteknologisk sikkerhedscoating til batteriapplikationer.

  • Elektronikmessen

    Mød Eltech Solutions A/S på Elektronikmessen 2026

  • Elektronikmessen

    Mød Strenometer på Elektronikmessen 2026

  • InnoFour

    Prepare for Cyber Resilience Act (CRA) compliance

  • Elektronikmessen

    Mød Aktuel Elektronik på Elektronikmessen 2026

  • EKTOS A/S

    Rethinking Electronics for Next-Gen Machines for the Real World, Not the Lab 

  • Microchip Technology Inc.

    Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making

  • InnoFour

    FPGA Forum 2026

  • Microchip Technology Inc.

    Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

  • HIN A/S

    Vil du arbejde i krydsfeltet mellem teknik, rådgivning og industri?

Vis alle nyheder fra vores FOKUSpartnere ›

International News (in English)

  • 800W robust and reliable power supplies

    31.08.2022

  • Embedded Flash Memory Products for Consumer Applications

    31.08.2022

  • New advanced multilayer inductors

    31.08.2022

  • SEGGER’s open BigFAT specification breaks FAT’s 4GB per file barrier

    29.08.2022

  • Telit’s LN920 LTE data card

    29.08.2022

  • Digitalisation processes for Industry 4.0 and IIoT

    29.08.2022

  • High-Voltage Power Film Capacitor for DC Filtering Applications

    26.08.2022

More news in English ›

Læs Aktuel Elektronik

Aktuel Elektronik avisforside

Annoncér i Aktuel Elektronik

Medieinformation

KONTAKT

TechMedia A/S
Naverland 35
DK - 2600 Glostrup
www.techmedia.dk
Telefon: +45 43 24 26 28
E-mail: info@techmedia.dk
Privatlivspolitik
Cookiepolitik