• LinkedIn
  • KONTAKT
  • ANNONCERING
  • PARTNERLOGIN

ElektronikFOKUS

Fokus på elektronik

  • Branchenyt
  • Design & udvikling
  • Events
  • IoT & embedded
  • Komponenter & konnektorer
  • Power
  • Produktion
  • Test & mål
  • Wireless & data
  • Artikler fra Aktuel Elektronik

International news16. 09. 2019 | Rolf Sylvester-Hvid

High-Speed Battery Charging in Next-Generation Electric Vehicles

International news16. 09. 2019 By Rolf Sylvester-Hvid

STMicroelectronics has been chosen to supply high-efficiency silicon-carbide (SiC) power electronics by Renault-Nissan-Mitsubishi (Alliance) for advanced on-board chargers (OBCs) in its upcoming electric vehicles.

Renault-Nissan-Mitsubishi plans to use the new SiC power technology to build more efficient and compact high-power OBCs that will further increase attractiveness of electric vehicles for the users by cutting battery-charging time and enhancing driving range. As Renault-Nissan-Mitsubishi’s chosen partner for advanced SiC technology, ST will provide design-in support to help maximize OBC performance and reliability.

ST is also to supply Renault-Nissan-Mitsubishi with associated components, including standard silicon devices. The OBCs with ST’s SiC are scheduled to enter volume production in 2021.

“As the pioneer and global leader in zero-emission electric vehicles, our objective remains to be the number one provider of mainstream mass-market and affordable EVs around the world,” said Philippe Schulz, Alliance VP Design Electric & Hybrid Powertrain. “The small size, light weight, and high energy efficiency we can achieve using ST’s SiC technology in our OBC, combined with the increased battery efficiency, will enable us to accelerate the adoption of electric vehicles by reducing charging times and extend the range of our EVs.”

Marco Cassis, President, Sales, Marketing, Communications and Strategy Development, STMicroelectronics, said, “SiC technology can help the world by reducing dependence on fossil fuels and increasing energy efficiency. ST has successfully developed manufacturing processes and established a portfolio of qualified, commercialized SiC products also in automotive-grade version. Building on our long cooperation, we are now working with Renault-Nissan-Mitsubishi to realize the many advantages SiC can bring to EVs. Moreover, this commitment helps ensure success by increasing the economies of scale to deliver superior-performing SiC-based circuits and systems that are also cost-effective and affordable.”

EVs need an OBC to handle charging from standard roadside charge points, when a dedicated home-charging system or super-charger is not available. The time to recharge is determined by the OBC power rating and the units in today’s EVs have ratings between about 3kW and 9kW.

As the leading EV brand, Renault-Nissan-Mitsubishi has already created a 22kW OBC for the Renault Zoe model, which can fully recharge the battery in about one hour. Now, by upgrading the OBC to leverage the superior efficiency and small size of ST’s SiC power semiconductors (MOSFETs and rectifier diodes), Renault-Nissan-Mitsubishi can further reduce the size, weight, and cost while increasing energy efficiency to make future models even more attractive for users and beneficial for the environment. The new, compact, and high-power OBC gives designers more freedom to style the vehicle and optimize packaging, weight distribution, and vehicle drivability.

SiC is a proven power-semiconductor technology that enables highly efficient power switches (MOSFETs) and rectifiers (diodes) and is backed by trusted reliability data. In engineering terms, SiC is a wide bandgap (WBG) semiconductor material that works at higher frequencies, can withstand higher operating temperatures, and with smaller form factors than traditional Silicon-based materials. These advantages give component designers superior control over device characteristics, better optimizing the balance among physical dimensions, MOSFET on-resistance (RDS(ON)), diode forward voltage (VF), and factors such as capacitance and gate charge that affect turn-on/off or reverse-recovery times and the energy dissipated when switching. Compared to conventional silicon, WBG semiconductors can withstand higher applied voltages in relation to device size, which allows lightweight components to be extremely rugged as well as highly energy-efficient.

In addition to automotive uses like OBCs, ST’s SiC MOSFETs and rectifiers are also widely used for power conditioning and conversion in the renewable-energy sector, and in other equipment such as industrial automation, high-voltage DC distribution, data-center power supplies, and smart lighting, where maximizing energy efficiency is the overriding demand.

Further information can be found at http://www.st.com

Skrevet i: International news

Seneste nyt fra redaktionen

STMicroelectronics’ multiplikatorfri PFC-controller til pris- og energifølsomme applikationer

Komponenter & konnektorerPower19. 06. 2026

STMicroelectronics' L6462A transition-mode (TM) PFC-controller reducerer BOM’en og forbedrer effektiviteten, hvilket gør det muligt for forbrugerprodukter og strømforsyninger op til 250W at opfylde strenge miljøvenlige designnormer. L6462A bruger en kurveformsgenerator til at producere en

HIN lancerer ny generation af manuel PCB-depaneling fra Piergiacomi

Produktion19. 06. 2026

Piergiacomi DPF-300EVO er udviklet til skånsom og fleksibel separation af printkort i mindre og mellemstore produktionsserier, hvor behovet for kvalitet og hurtige omstillinger er højt – men hvor investering i en fuldautomatisk router ikke nødvendigvis giver mening. Den nye EVO-version byder

Konfigurer, kombiner og tilpas med Sick Nova og Visionary‑T Mini

IoT & embeddedWireless & data19. 06. 2026

Sicks kompakte 3D‑snapshot-kamera, Visionary‑T Mini med Sick Nova-integration tilbyder med sin enkle betjening og høje datakvalitet en løsning til stort set alle behov inden for 3D Machine Vision. Takket være den fremtidsorienterede 3D time‑of‑flight‑teknologi leverer hver enkelt pixel præcise

Betydelig vækst i datacentre øger efterspørgslen efter energieffektive løsninger

PowerWireless & data19. 06. 2026

Den kraftige vækst skaber et øget behov for løsninger, der kan understøtte en effektiv drift af fremtidens datacentre. Her spiller energieffektive pumpesystemer og intelligente styringsløsninger en stadig vigtigere rolle, fordi selv mindre optimeringer kan have stor betydning i anlæg med et højt

Ny AI-platform giver danske virksomheder kraftig AI på dansk jord

AktueltWireless & data19. 06. 2026

I flere år har danske virksomheder stået med et svært valg, når de ville implementere generativ AI i forretningen. Enten gik de på kompromis med ydeevnen, eller også accepterede de, at forretningskritiske data forlod landet og blev behandlet hos udenlandske cloud- og AI-udbydere. Med lanceringen

3D FeRAM i 22nm node baner vejen for hurtigere og mere energieffektiv edge AI

AktueltDesign & udvikling19. 06. 2026

Franske CEA-Leti har på VLSI konferencen i Honolulu medio juni demonstreret noget af et gennembrud for ferroelektrisk RAM (FeRAM) hukommelser ved at anvende en 3D kondensator arkitektur i en 22 nm proces. Det baner vejen for en hurtigere og mere energieffektiv kunstig intelligens (AI) i edgen. Ved

AAU og SDU vil sammen styrke innovation og digital suverænitet

BranchenytDesign & udviklingTop19. 06. 2026

Aalborg Universitet og Syddansk Universitet vil udvikle en fælles digital platform, der skal styrke innovationen og gøre vejen fra forskning til virksomhed både kortere og enklere. Med projektet “SPINS; Spinout platform for innovation and European sovereignty ” vil de to universiteter samle centrale

Toshiba lancerer komplementær 30V dual-MOSFET

Komponenter & konnektorer17. 06. 2026

Toshiba Electronics Europe GmbH lancerer nu SSM6L826R, en ny 30 V dual-MOSFET, der samler både N- og P-kanal MOSFETs i én samlet pakke. Produktet er oplagt til applikationer som enfasede BLDC-motorstyringer (børsteløse DC), motorstyringer til konventionelle DC-motorer samt belastnings-switche til

XpressConnect PCIe 6.0 og CXL 3.1 re-timere fra Microchip

Komponenter & konnektorer17. 06. 2026

Med stadigt større AI-arbejdsbelastninger bliver designere af datacentre i stigende grad begrænset med hensyn til signalernes rækkevidde og latency, hvorved værdifulde memory-ressourcer i store GPU-clusters kan forblive uudnyttede. Udfordringerne forstærkes af de højere interconnect-hastigheder. Ved

KMD melder sig ind i Dansk Industri

Branchenyt17. 06. 2026

Med en ny strategi har KMD sat en klar retning. KMD skal fortsat være en stærk leverandør af kritiske it-løsninger til sine kunder, men samtidig i højere grad også være en strategisk partner, der bidrager med indsigt, rådgivning og løsninger på nogle af de største udfordringer, som kunder og

Tilmeld Nyhedsbrev

Tilmeld dig til dit online branchemagasin/avis

 
 
 
 
Aktuel Elektronik - underleverandøroversigt
Få fuld adgang til indlægning af egne pressemeddelelser… Læs mere her

/Nyheder

  • InnoFour

    Progressive Verification: A practical and effective approach to PCB Design verification

  • ACTEC A/S

    Fra Panasonic Powerline til Energizer

  • Mouser Electronics

    Mouser Earns NEUTRIK America’s Top Awards for Distribution and Revenue Performance

  • ODU Denmark

    Strømlinet test-setup og stabile forbindelser

  • InnoFour

    Xpedition Creepage Shift Left: Strengthen safety and reliability through early validation

  • Mouser Electronics

    Authorised Distributor Mouser Electronics Offers Engineers the Latest in AI and Edge Technologies from Altera

  • HIN A/S

    Industriudsugning handler ikke længere kun om at fjerne røg

  • Microchip Technology Inc.

    Registration Now Open for Microchip’s European MASTERs Conference

  • Mouser Electronics

    Mouser Receives Top Distribution Awards from Vishay Intertechnology for Fifth Consecutive Year

  • Mouser Electronics

    Mouser Named 2025 High Service Distributor of the Year for Fourth Time by Hirose Electric

Vis alle nyheder fra vores FOKUSpartnere ›

International News (in English)

  • 800W robust and reliable power supplies

    31.08.2022

  • Embedded Flash Memory Products for Consumer Applications

    31.08.2022

  • New advanced multilayer inductors

    31.08.2022

  • SEGGER’s open BigFAT specification breaks FAT’s 4GB per file barrier

    29.08.2022

  • Telit’s LN920 LTE data card

    29.08.2022

  • Digitalisation processes for Industry 4.0 and IIoT

    29.08.2022

  • High-Voltage Power Film Capacitor for DC Filtering Applications

    26.08.2022

More news in English ›

Læs Aktuel Elektronik

Aktuel Elektronik avisforside

Annoncér i Aktuel Elektronik

Medieinformation

KONTAKT

TechMedia A/S
Naverland 35
DK - 2600 Glostrup
www.techmedia.dk
Telefon: +45 43 24 26 28
E-mail: info@techmedia.dk
Privatlivspolitik
Cookiepolitik