• LinkedIn
  • KONTAKT
  • ANNONCERING
  • PARTNERLOGIN

ElektronikFOKUS

Fokus på elektronik

  • Branchenyt
  • Design & udvikling
  • Events
  • IoT & embedded
  • Komponenter & konnektorer
  • Power
  • Produktion
  • Test & mål
  • Wireless & data
  • Artikler fra Aktuel Elektronik

International news17. 01. 2020 | Rolf Sylvester-Hvid

Analog Devices Showcases the Future of Data Acquisition at Embedded World 2020

International news17. 01. 2020 By Rolf Sylvester-Hvid

Visitors to the Analog Devices (ADI) stand (Hall 4A, Booth #240) at embedded world 2020 Nuremberg, Germany, 25 – 27 February, will be shown a wide range of demonstrations showcasing the company’s embedded-technology offerings. Highlights of the 2020 presentations will include technology that highly integrates complete signal chains into a “More-than-Moore” semiconductor solution, as well as a range of solutions to simplify the design and deployment of the highest-performance measurement systems. The company will further underscore its deep expertise at the intersection of the physical and digital world by delivering presentations on a wide range of topics at the show’s Conference and Exhibitor Forums.

Measurement systems in a few clicks
Prominent on the stand will be a demonstration featuring the capabilities of the company’s MeasureWare offering. MeasureWare greatly simplifies the process of configuring and rapidly optimising the performance of a measurement system. This demonstration will show how specialists in their individual fields – who are not necessarily experts in the design of instrumentation signal chains – can be empowered to get complex precision measurements up-and-running in minutes, without any firmware development. The demo will show how flexible hardware modules, together with intuitive software, work with sensors from ADI and its partners to rapidly take a measurement task from initial sketch to production readiness.

Analogue and data-conversion simulation
Analog Devices’ LTspice has long been recognised as a benchmark in precision simulation in the analogue space, and at the interface between the analogue and digital signal domains. The software will be featured in a demonstration, with particular emphasis on highlighting how the simulator and its associated Error Budget calculator demo can deliver high accuracy using precision converter LTspice models.

Sensing and networking for Smart Shelves
Two related demonstrations reveal how the breadth of technologies in the company’s portfolio can deliver total solutions to specialised application areas. Instrumented shelves in retail outlets or warehouses can sense product quantity by weight, interrogate “smart labelling” to track individual items, and network the data gathered – all using technologies at ADI’s disposal.

Electronic shelf labelling offers retail and warehousing the capability to reconfigure pricing or storage at will. Among the requirements for such a system are low power operation combined with the ability to address large numbers of display points. This demonstration will show how Analog Devices can meet these needs; the semiconductor manufacturer will feature its Rapid Net wireless protocol that can reliably manage and update more than 10,000 nodes. Also highlighted will be the company’s optical sensing capability as a means of updating the display on the electronic label.

Fastest route to a functional signal chain
ADI will also host the debut of the SEMADUC Kit offered by its distribution partner SEMITRON. Aimed at a broad range of applications across industrial, instrumentation, healthcare and transportation, the kit offers a flexible platform for evaluation of any type of signal chain requirements using MikroE Click Boards™. The small-form-factor system employs compatible add-on boards and provides a seamless out-of-box experience and zero hardware configuration with the MikroE SDK (firmware, application and demos). The hardware supports a range of Analog Devices signal handling and data conversion ICs.

Far field voice acquisition
Voice User Interface (VUI) is continuing to capture an increased share of Human Machine Interface (HMI) functions in consumer, automotive and industrial spaces. ADI’s partner voice INTER connect has developed vicDIVA, a professional solution for robust voice acquisition under varying environmental conditions. The platform will showcase voice INTER connect’s efficient beamforming and beam steering algorithms, using a range of microphone array configurations, that ensure excellent speech quality, isolating an individual speaker at a distance, even in the presence of surrounding noise. Low latency real-time audio processing capabilities are essential in this area, which are enabled by ADI’s scalable SHARC DSP portfolio.

Learn from experts
In addition to its on-stand demonstrations ADI specialists will deliver papers at embedded world 2020.

embedded world Conference
On Tuesday, 25 February, at 10:30 am, Michael Hennessy, Marketing Manager for Signal Chain µModules, will deliver a paper entitled “Changing the Precision Conversion Playing Field with Heterogeneous Integration (HI)” and will expand on how Analog Devices is integrating disparate semiconductor technologies on high-density substrates to change the Precision Conversion Playing Field. Visitors can view a corresponding demo on the ADI booth. On Wednesday, 26 February at 12:00 pm, Systems Applications Engineer, Connected Motion and Robotics, Richard Anslow, will present, “MEMs Based Wired Condition Monitoring Solution for Industry 4.0”. This paper discusses a novel communication scheme for porting SPI output from MEMs accelerometers over long distance for condition-based monitoring (CbM).

embedded world exhibitor forum
On Wednesday, 26 February, at 11:30 am (Forum Hall 3A, Booth #3A-730), Liam Riordan, System Applications Manager for MeasureWare, will present, “MeasureWare – A new approach to precision measurement”, describing this new initiative targeted at taking the complexity out of precision measurements.

embedded world 2020 takes place at the Nuremberg, Germany exhibition grounds, from 25th to 27th February (details)

Skrevet i: International news

Seneste nyt fra redaktionen

ODU investerer i fremtiden med nyt automatiseret logistikcenter

BranchenytKomponenter & konnektorer12. 03. 2026

ODU åbner et nyt logistikcenter i sit hovedsæde i Mühldorf am Inn nær München. Logistikcenteret repræsenterer en markant investering i endnu mere effektiv produktion og distribution. Byggeriet er samtidig et initiativ, der rækker langt ind i fremtiden. Det fem-etagers byggeri indeholder bl.a.

Distributionsaftale mellem Farnell og Same Sky

AktueltBranchenyt12. 03. 2026

Same Sky fortæller, at virksomheden har indgået en global distributionsaftale med Farnell, en af verdens førende distributører af elektroniske komponenter. Som en del af aftalen vil Farnell distribuere og markedsføre Same Skys omfattende produktportefølje inklusive audio, interconnects, termiske

EU-chip pilotlinie åbner adgang for anden runde af avanceret halvlederteknologi

AktueltDesign & udvikling12. 03. 2026

Af Jørgen Sarlvit Larsen Det europæiske FAMES Pilot Line initiativ, der koordineres af franske CEA-Leti i Grenoble, har pr. 9. marts, 2026 åbnet anden runde af sin Open-Access Call for nye chiparkitekturer. Projektet skal booste den europæiske halvlederindustri, og interessenter i denne branche

Sammenlægning skal styrke forskningsbaseret rådgivning fra Aarhus Universitet

BranchenytDesign & udvikling12. 03. 2026

Aarhus Universitet har besluttet en organisatorisk sammenlægning af to nuværende centerenheder for forskningsbaseret rådgivning inden for natur, miljø, klima, energi, fødevarer og landbrug. Hidtil har indgangen til denne rådgivning været fordelt på to centerenheder under henholdsvis DCA – Nationalt

Pindsvin kan høre ultralyd – dansk forskning kan være nøglen til færre trafikdrab

Design & udvikling12. 03. 2026

Det europæiske pindsvin er et af vores mest elskede pattedyr, men bestanden er i bekymrende tilbagegang, og en af hovedårsagerne er, at de bliver påkørt af biler. Men nu viser et nyt studie, at pindsvin kan høre ultralyd. Og det kan få betydning for deres overlevelse. Adjunkt ved Statens

Trend på Embedded World: Bottom-up modeldesign frem for hardwarevalg

Design & udviklingIoT & embeddedTop12. 03. 2026

Af Rolf Sylvester-Hvid, Embedded World, Nürnberg En udtalt tendens på dette års Embedded World er, at stadigt flere producenter af processorer og controllere bevæger sig væk fra det traditionelle hardware-design, ligesom AI og agents skubber til den etablerede designforståelse. Design med

Arrow Electronics og NXP tilpasser risikoanalyse, sikkert design og levering efter CRA

AktueltDesign & udviklingIoT & embedded10. 03. 2026

Arrow Electronics samarbejder med NXP Semiconductors for at støtte kunder i forberedelserne til EU's Cyber ​​Resilience Act (CRA), som fastsætter obligatoriske, væsentlige cybersikkerhedskrav for produkter med digitale elementer, der sælges i Den Europæiske Union. Med fuld håndhævelse planlagt til

Recom satser på diskrete PSU-komponenter

AktueltKomponenter & konnektorerPower10. 03. 2026

Recom lancerer en ny serie af effekt-IC'er og SMD-transformere, der giver kunderne mulighed for at bygge deres egne diskrete DC/DC-isolerede strømforsyninger. Sortimentet omfatter RVP6501, et pin-kompatibelt sekundært kilde-alternativ til den populære 6501-type push-pull transformator

Dansk kameraløsning afslører skadeligt blåt lys fra lysdioder

Test & mål10. 03. 2026

Viso Systems ApS er én af de danske virksomheder, vi møder igen og igen på en messe som Light & Building. Og det er et glædeligt gensyn med god grund: Den københavnske producent af højteknologisk lysmålingsudstyr som den imponerende Labspy og den mindre ”bordmodel”, Basespy, leverer løsninger,

HIN styrker programmet inden for loddematerialer med Balver Zinn

BranchenytProduktion10. 03. 2026

Med tilføjelsen af Balver Zinn til porteføljen styrker HIN sin position som totalleverandør til elektronikproduktion. For kunderne betyder det, at en større del af de materialer, der indgår i loddeprocessen, nu kan samles hos én samarbejdspartner. Det giver en række fordele i hverdagen:- Én

Tilmeld Nyhedsbrev

Tilmeld dig til dit online branchemagasin/avis

 
 
 
 
Aktuel Elektronik - underleverandøroversigt
Få fuld adgang til indlægning af egne pressemeddelelser… Læs mere her

/Nyheder

  • Elektronikmessen

    Mød FORCE Technology på Elektronikmessen

  • InnoFour

    Polarion X 2512 Release

  • Elektronikmessen

    Elektronikmontage i miniformat: Nye kombimaskiner vises på Elektronikmessen

  • Elma Instruments A/S

    Nyhed – Professionel fugtmåling med dokumentation i én løsning

  • Würth Elektronik Danmark A/S

    Variable DC/DC strømforsyninger i micropackage

  • Mouser Electronics

    New eBook from Mouser, Microchip, and Samtec Examines PCIe Design for Emerging Embedded Systems

  • Elektronikmessen

    Elektronikmessen: Hent din gratis billet nu

  • Microchip Technology Inc.

    Microchip Expands Security Services in the Trust Platform to Help Manufacturers Meet Cybersecurity Regulations

  • Würth Elektronik Danmark A/S

    Würth Elektronik udvider porteføljen af varmeledende tape og pads til håndtering af varmeafgivelse fra aktive komponenter

  • Mouser Electronics

    Mouser Electronics and Sensirion Host Webinar on Air Quality and Flow Sensing in HVAC

Vis alle nyheder fra vores FOKUSpartnere ›

International News (in English)

  • 800W robust and reliable power supplies

    31.08.2022

  • Embedded Flash Memory Products for Consumer Applications

    31.08.2022

  • New advanced multilayer inductors

    31.08.2022

  • SEGGER’s open BigFAT specification breaks FAT’s 4GB per file barrier

    29.08.2022

  • Telit’s LN920 LTE data card

    29.08.2022

  • Digitalisation processes for Industry 4.0 and IIoT

    29.08.2022

  • High-Voltage Power Film Capacitor for DC Filtering Applications

    26.08.2022

More news in English ›

Læs Aktuel Elektronik

Aktuel Elektronik avisforside

Annoncér i Aktuel Elektronik

Medieinformation

KONTAKT

TechMedia A/S
Naverland 35
DK - 2600 Glostrup
www.techmedia.dk
Telefon: +45 43 24 26 28
E-mail: info@techmedia.dk
Privatlivspolitik
Cookiepolitik