Surviving the Heat Wave

A presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies

This webinar will address issues at the IC, package, circuit board and system level where design changes made by the industry have had a significant impact on the thermal capabilities of the products. We will examine IC wearout, ceramic capacitors, EOS, bond wires, stacked die, solder phase coarsening, PCB materials, PTH fatigue, heatsinks and new methods for thermal transfer control.

Thursday the 27th of October 2016, 5:00 PM – 6.30 PM CEST and 8:00 PM – 9.30 PM CEST

Register here.