• LinkedIn
  • KONTAKT
  • ANNONCERING
  • PARTNERLOGIN

ElektronikFOKUS

Fokus på elektronik

  • Branchenyt
  • Design & udvikling
  • Events
  • IoT & embedded
  • Komponenter & konnektorer
  • Power
  • Produktion
  • Test & mål
  • Wireless & data
  • Artikler fra Aktuel Elektronik

International news26. 09. 2018 | Rolf Sylvester-Hvid

Computer-on-Module featuring the latest AMD Processor offers highest Scalability and graphics Performance at small Footprint

International news26. 09. 2018 By Rolf Sylvester-Hvid

Kontron introduces its new COMe-cVR6 (E2) Module in the COM Express® Compact Type 6 form factor. It is based on the new AMD Ryzen(TM) Embedded V1000 processor, which sets the benchmark for high-end embedded computer modules. The COM Express® Compact module’s smaller form factor significantly saves space in comparison to most comparable solutions, allowing developers to create more compact designs with higher performance. Variants of the COMe-cVR6 (E2) are also resitant to vibration and shocks thanks to their permanently soldered memory, just as all other components, such as voltage dividers, capacitors, and controllers are selected for highest resistance to environmental stresses. The new COM Express® module is particularly suitable for applications in harsh environments, medical or industrial image processing systems, as well as complex automation systems.

The new AMD Ryzen(TM) Embedded V1000 processors combine the extremely powerful “Zen” microprocessor architecture with the new AMD Radeon(TM) Vega graphics supporting up to 11 compute units. The AMD Ryzen(TM) Embedded V1000 processor offers up to twice the performance than the previous versions and delivers up to 46% more multi-thread performance than competitive solutions. All in all, the new Accelerated Processing Unit (APU) with Zen CPU and Vega GPU achieve a performance throughput of up to 3.6 TFLOPS.

The new APUs offer a comprehensive feature set for data and application security. The built-in AMD Secure Processor handles hardware-accelerated data encryption and decryption. For secure virtualization, Secure Encrypted Virtualization (SEV) isolates the hypervisors and virtual machines without having to modify any of the code.

The new COMe-cVR6 (E2) offers a total of eight USB interfaces, two of which are USB 3.1 Gen 2. By default, it offers five PCIe 3.0 Lanes, with the option of using one of these for a PCIe switch offering four PCIe 2.0 lanes on the COMe socket. Three independent display ports supplemented by LVDS or, optionally, eDP, cover a wide variety of image-intensive application scenarios through the resulting flexibility. Apart from other common interfaces such as SATA, I2C, and SMBus, two serial interfaces, a High Definition Audio Interface, and Gigabit Ethernet complete the feature set.

The Kontron modules equipped with the new AMD Ryzen(TM) Embedded V1000 processors offer highest design flexibility. The type 6 form factor is ideal for AMD Ryzen(TM) Embedded V1000 processors, as it offers the greatest variety of interfaces and the highest number of common PC extensions. Basing a design on COM Express® Compact rather than COM Express Basic® specifications reduces footprint by about 22 percent, enabling more compact designs.

This also offers greater comfort and design freedom for larger systems. For instance, it enables developers to create flatter designs within a given system footprint. The space savings on the carrier board mean the external I/Os can be placed next to the compact module instead of having to attach them on the underside of the carrier board. Compared to COM Express® Basic designs, this can reduce the height by up to 2 cm.

Since the specifications of Basic and Compact are identical except for the dimensions – even the mounting holes for vibration-proof fixing of the modules on the carrier board are congruent – Compact modules can be used seamlessly in Basic designs.

The new COM Express® module with AMD Ryzen(TM) processor offers not only the standard DIMM bar, but also the option to additionally or alternatively use soldered memory. As a result, the module supports a total of up to 24 GB RAM. In addition, all other components such as voltage dividers, capacitors, and controllers offer highest durability and reliability even under stressful environmental influences. The new COM Express® modules are designed for an operating life of at least ten years in harsh industrial environments.

For more information please visit: https://www.kontron.com/products/boards-and-standard-form-factors/com-express/com-express-compact/come-cvr6-e2-.html

Skrevet i: International news

Seneste nyt fra redaktionen

AI og kritisk infrastruktur i fokus på Technomania i Messecenter Herning

Events09. 05. 2025

Årets Technomania tapper ind i den usikre verdenssituation, hvor Danmark og Europa i højere grad skal udvikle egne teknologiske løsninger, og hvor beskyttelsen af vores kritiske infrastruktur står højt på den politiske dagsorden. - Danmark har et stort vækstlag af dygtige virksomheder og

Mouser Electronics New Product Insider: Over 8.000 nye komponenter tilføjet i 1. del af 2025

BranchenytKomponenter & konnektorer09. 05. 2025

I 1. kvartal af 2025 lancerede Mouser mere end 8.000 nye partnumre til levering direkte fra lager. Blandt de produkter, som Mouser introducerede fra januar og gennem marts 2025, finder man: For at se flere New Product Insider highlights, besøg: https://info.mouser.com/new_products/.For flere

Gate-driver optokobler øger sikkerhed ved switching af SiC MOSFETs

Komponenter & konnektorerPower09. 05. 2025

Toshiba Electronics Europe GmbH lancerer en gate-driver optokobler, der egner sig til at styre siliciumcarbid (SiC) MOSFETs i industrielt udstyr som industrielle invertere, UPS’er (uninterruptible power supplies) og solcellepanel (PV) invertere, der alle kan opleve hårde termiske miljøer. TLP5814H

Telenor henter ny erhvervsdirektør med stærk it- og ledelsesbaggrund

Branchenyt09. 05. 2025

Telenor Danmark har ansat Rasmus Rimhoff som ny direktør for Telenor Erhverv. Rimhoff tiltræder den 6. maj og får ansvar for at styrke Telenors position på det danske erhvervsmarked. Rasmus Rimhoff kommer fra en stilling som Senior Vice President for Software, Cloud & Service i Atea A/S, hvor

Den tyske forbundsregering godkender økonomisk støtte til Infineons nye Dresden-fab

AktueltDesign & udviklingProduktion09. 05. 2025

Infineon Technologies AG har modtaget den endelige godkendelse til finansieringen af ​​sin nye fabrik i Dresden (Smart Power Fab) fra det tyske forbundsministerium for økonomi. Infineon udvider anlægget for at imødekomme kundernes efterspørgsel efter f.eks. vedvarende energi, effektive datacentre og

Terma og Lockheed Martin underskriver ”Memorandum of Understanding”

AktueltDesign & udviklingProduktion09. 05. 2025

Terma og Lockheed Martin har yderligere styrket deres langvarige samarbejde ved at underskrive et Memorandum of Understanding (MoU) under en ceremoni afholdt på Termas kontor i Søborg. Memorandummet, underskrevet af Termas administrerende direktør Henriette Hallberg Thygesen og Lockheed Martin

I dag åbner Danmarks nye AI-forskningscenter

Design & udviklingTop09. 05. 2025

”Det Nationale Center for AI i Samfundet” – CAISA – vil samle nogle af landets førende AI-forskere for at kortlægge, hvordan vi i et demokrati som Danmark bedst udvikler og håndterer kunstig intelligens. Københavns Universitet får sammen med Aalborg Universitet en ledende rolle i centeret, som også

Ny teknologi øger holdbarhed og sikkerhed i luftfartsektoren

Design & udvikling07. 05. 2025

Sensorer og digital twins kan optimere måden, vi vedligeholder luftfartøjer på, så færre ressourcer går til spilde. Teknologisk Institut samarbejder med internationale partnere på at skabe sikrere fly og droner med længere levetid i EU-projektet Avatar. – Mens det tidligere har været nødvendigt

B511-1C evaluerings-board fra Panasonic Industry til hurtig test og prototyping

IoT & embedded07. 05. 2025

Panasonic Industry lancerer nu sit nye B511-1C evaluerings-board (ENW89861AXKF). Det indeholder et PAN B511-1C (ENW89861A3KF) modul, der er baseret på Nordic Semiconductors nRF54L15 single-chip controller. Evaluerings-boardet rummer en pin-header i et Arduino UNO footprint, der kan konfigureres

Kompakt strømforsyningsserie med enkelt udgang til generel brug

Power07. 05. 2025

TDK Corporation introducerer TDK-Lambda GUS350-serien af ​​kompakte strømforsyninger med en enkelt udgang (single-ended) til generel brug. Modellerne leverer nominelt 350W med 12V, 24V, 36V eller 48V på udgangen. GUS350 er konvektionskølet og fås med justeringsfunktion for udgangsspænding,

Tilmeld Nyhedsbrev

Tilmeld dig til dit online branchemagasin/avis

 
 
 
 
Aktuel Elektronik - underleverandøroversigt
Få fuld adgang til indlægning af egne pressemeddelelser… Læs mere her

/Nyheder

  • InnoFour

    Sigma Connectivity creates world’s most compact EX, 5G smart devices using Siemens EDA Xpedition

  • RODAN Technologies A/S

    RODAN Technologies tildeles Experians RKI Diplom for Højeste Kreditvurdering i Danmark

  • Mouser Electronics

    Mouser Electronics Shipping Wide Selection of Smart, Connected and Secure Embedded Control Solutions from Microchip Technology

  • Mouser Electronics

    Mouser Delivers Expert Perspectives on Robotics, AI and ML in New eBook from Analog Devices and Samtec

  • Power Technic ApS

    CSP 3000W Strømforsyning til UV udstyr

  • Avnet Silica

    ROBOTIC SEMINAR 21+22 of May 2025 Online

  • InnoFour

    Customer story: Improved product quality using HyperLynx PI

  • Mouser Electronics

    Mouser Explores Smart Tech in Farming with Agriculture Resource Hub

  • Beckhoff Automation ApS

    AX1000 – economy servodrev til lav og middel effektområdet

  • ACTEC A/S

    Driftssikkerhed starter i designfasen – ses vi på Robotbrag?

Vis alle nyheder fra vores FOKUSpartnere ›

International News (in English)

  • 800W robust and reliable power supplies

    31.08.2022

  • Embedded Flash Memory Products for Consumer Applications

    31.08.2022

  • New advanced multilayer inductors

    31.08.2022

  • SEGGER’s open BigFAT specification breaks FAT’s 4GB per file barrier

    29.08.2022

  • Telit’s LN920 LTE data card

    29.08.2022

  • Digitalisation processes for Industry 4.0 and IIoT

    29.08.2022

  • High-Voltage Power Film Capacitor for DC Filtering Applications

    26.08.2022

More news in English ›

Læs Aktuel Elektronik

Aktuel Elektronik avisforside

Annoncér i Aktuel Elektronik

Medieinformation

KONTAKT

TechMedia A/S
Naverland 35
DK - 2600 Glostrup
www.techmedia.dk
Telefon: +45 43 24 26 28
E-mail: info@techmedia.dk
Privatlivspolitik
Cookiepolitik