Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has announced that its innovative SpiStack® dual-die NOR+NAND code storage product has been included on NXP® Semiconductors FRWY-LS1012A board for use with its Layerscape® LS1012A communications processor.
NXP chose Winbond’s W25M161AW SpiStack product for its new FRWY-LS1012A development board for the LS1012A processor. The W25M161AW provides 16Mbits of serial NOR Flash memory for the board’s boot code, and 1Gbit of serial NAND for its Linux operating system.
The stacked-die construction of the SpiStack products and the software Chip Select capability developed by Winbond enable a serial NOR Flash die for fast boot and a serial NAND die for high memory density to be accommodated in an 8-terminal WSON package with a standard 8mm x 6mm footprint and pin-out.
“The W25M161AW SpiStack device provides the perfect pairing with our Layerscape LS1012A SoC,” commented Jeff Steinheider, director, product marketing, NXP Industrial Applications Processors. “The W25M161AW saves board real-estate for compact designs with the LS1012A, while still providing 1Gbit of storage for a full featured Linux OS.”
Winbond’s new High-Performance Serial NAND technology also supports a two-chip dual-quad interface which gives a maximum data transfer rate of 166MB/s.
This high-speed Read operation, some four times faster than existing serial NAND memory devices offer, means that the new W25N01JW chip can replace SPI NOR Flash memory in automotive applications such as data storage for instrument clusters or the Center Information Display (CID).
This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of 7” and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher. At these capacities, serial NAND Flash has a markedly lower unit cost than SPI NOR Flash, and occupies a smaller board area per Mbit of storage capacity.
Syed S. Hussain, Director Segment Marketing at Winbond, said: ‘Winbond’s TECHNOLOGY at the Flash Memory Summit is proof of our continued commitment to product development in the low- to medium-density specialty memory sector. The SpiStack and High Performance Serial NAND products are great examples of the way that Winbond invents creative solutions to enable our customers to get the storage capacity and performance that they need in small packages at a competitive cost.’
Both the W25M161AW and W25N01JW are available now in production volumes. More information may be found at http://www.winbond.com.
