InnoFour

DfR Solutions Web Seminar: System Level Effects on Solder Joint Reliability

Electronic systems may often fail, not because of poorly designed chips, substrates or other components, but because of the failure of the solder joints that link them all together. The mismatch between PCB solder materials can result in thermal expansion problems including excessive strain, cracking and open circuits. The impact of thermal fatigue, soldering defects, vibration and residual strains must be considered when analyzing solder reliability. These and other issues are often exposed in accelerated stress tests.

In this webinar DfR Solutions Research Engineer, Maxim Serebreni, PhD, will discuss Thermo-mechanical fatigue of solder interconnects, shear and tensile effects, glass style, improper conformal coating, and mirroring on solder fatigue. He will also review the Physics of Failure methodology and solder alloy selection approach.

Thursday April 27, 2017, 11.00 AM EST or 2:00 PM EST.