Mentor launches unique, end-to-end Xpedition High-Density Advanced Packaging flow
Mentor, a Siemens business, announced the industry’s most comprehensive and productive solution for advanced IC package design, the Xpedition® High-Density Advanced Packaging (HDAP) flow. This comprehensive end-to-end solution, from rapid prototyping to GDS signoff, combines the Mentor® Xpedition, HyperLynx®, and Calibre® technologies. The new Mentor IC package design flow delivers faster, higher-quality results compared to existing HDAP methodologies and technologies. The Xpedition HDAP design environment provides early, rapid and accurate “what-if” prototype evaluations in just hours versus days or weeks compared to existing tools and processes, enabling exploration and optimization of HDAP designs before detailed implementation.
More info can be found here.