AMD announced the general availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly code-named “Milan-X.” As the highest-performing x86 server CPUs for technical computing, these latest processors deliver the industry’s largest L3 cache, leadership packaging innovation and modern security features.
Please find a keynote video here.
3rd Gen AMD EPYC processors with AMD 3D V-Cache technology deliver:
- The industry’s largest L3 cache delivering impressive performance for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis.
- Outstanding leadership performance in technical computing workloads:
- EDA – The 16-core, AMD EPYC 7373X CPU can deliver up to 66 percent faster simulations on Synopsys VCS™, when compared to the EPYC 73F3 CPU.
- FEA – The 64-core, AMD EPYC 7773X processor can deliver, on average, 44 percent more performance on Altair® Radioss® simulation applications compared to the competition’s top of stack processor.
- CFD – The 32-core AMD EPYC 7573X processor can solve an average of 88 percent more CFD problems per day than a comparable competitive 32-core count processor, while running Ansys® CFX®.
- Industry-wide ecosystem support with solutions from a wide array of major OEMs, ODMs, SIs, ISVs and the cloud
- Microsoft Azure HBv3 VMs are the fastest adopted addition to the Azure HPC platform ever and are available today.
- Micron has already seen a 40% uplift on select EDA workloads, compared to non-stacked 3rd Gen EPYC, in their data centers
