Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the automotive qualified EasyPACK™ 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A rms. With its featured specs, the module is optimized for inverter applications in hybrid and electric vehicles.
Over the past ten years, Infineon has sold more than 50 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters. The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon’s previous chip generation by 20 percent.
Over the past ten years, Infineon has sold more than 50 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters. The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon’s previous chip generation by 20 percent.
